Technical Application of High-precision Thick Film Printing

In the preparation process of multi-layer ceramic circuit boards, through-hole, wall-mounted/filled-hole, and buried-hole printing are key steps to achieve circuit interconnection. These processes require the slurry to be evenly distributed within the holes to ensure the stability and reliability of the circuit. This article will focus on the application of high-precision thick film printing technology in this field.

1. Technical background and requirements
1. Through-hole and wall-mounted process: The slurry is printed on the inner wall of the hole of green porcelain, hard porcelain and other base materials through an inclined or vertical scraper. The slurry on the inner wall is required to be uniform and without cracks.
2. Hole filling and hole burying process: Print the slurry evenly in the entire hole. It is required that the slurry in the hole is full and uniform, and there is no slurry thrown out from the outer circle of the hole.
2. Advantages of high-precision thick film printing technology
Hole filling and buried hole processes include screen printing and electroplating hole filling
, laser hole filling, chemical deposition hole filling, etc., through-hole and wall-hanging processes include screen printing, spray coating, artificial brush coating, etc. Among them, high-precision screen printing technology is a low-cost, stable process and high efficiency. This printing method is widely used in wall hanging/hole filling process. However, due to the high requirements for printing accuracy and uniformity, ordinary screen printing machines cannot meet the printing requirements. The high-precision thick film screen printing machine HG-250-LTCC pictured below is suitable for hole filling and buried hole processes.
1. High-precision printing: using suspension printing system, minimum printing pressure: ±0.01kg, high printing accuracy.
2. Precision structure: Precision mechanical design is adopted to improve the accuracy and repeatability of printing.
3. CCD alignment system: Equipped with an advanced CCD alignment system, it can quickly identify the substrate placement deviation within 0.3S and automatically correct it to ensure the accuracy of the printing position.

4. Special platform for hole filling: micron-level pore size, effectively avoiding adsorption traces on the back of the product, high adsorption rate, and good hole filling effect.
5. Multi-function printing: The equipment can be adapted to fill holes in products with apertures ranging from 0.15mm to 0.45mm.
High-precision thick film printing technology plays an important role in through-hole, wall-mounted/filled-hole, and buried-hole processes with its advantages of high precision, high stability, and high efficiency. With the continuous development of fields such as microelectronics manufacturing and ceramic packaging, the requirements for printing technology will become increasingly higher. In the future, high-precision thick film printing technology will continue to undergo technological innovation and optimization to meet a wider range of application needs.